Huawei plans release of the Kirin 970 processor early next year. The firm’s flagship chipset will be built on TSMC’s 10nm manufacturing process.
The confirmation on the reported release of Kirin 970 processor came from Taiwan. TSMC is based in Taiwan.
TSMC has developed its own 10nm manufacturing process. It rivals that of Samsung Electronics. Samsung’s 10nm technology powers the Snapdragon 835 Octa-core SoC. There are two other 10nm processors: Qualcomm’s SD 835 and MediaTek’s Helio X30.
Also Read: Huawei P10 For Release In April 2017
A Weibo user claimed Kirin 970 will have an octa-core CPU. The CPU will consist of four ARM Cortex-A73 cores and four ARM Cortex-A53 cores. Also, the next-generation chipset will have a maximum clock frequency of between 2.8GHz – 3.0GHz.
Huawei will supposedly unveil the Kirin 970 in the first quarter of 2017.
Huawei Mate 10 Will Pack Kirin 970
Meanwhile, the P10 will still use Kirin 960 chipset. Sources say the Chinese firm scheduled P10’s launch in the first quarter of 2017.
Earlier, there were rumors about Mate 9, Huawei’s flagship phablet, sporting the Kirin 970. But it came with the Kirin 960.
On the other hand, Huawei Mate 10 will pack the Kirin 970. The company will reportedly release Mate 10 in the second half of next year.
Kirin 960 uses ARM’s Mali-G71 GPU and is built on a 16nm manufacturing process. It boasts of four ARM Cortex A73 cores clocked at 2.4 GHz. The A73 can sustain peak performance longer, which is good for gaming.
HiSilicon optimized Kirin 960’s memory system, and puts in support for UFS2.1 flash memory. This enhances the device’s capability to improve read and write speeds. It also enhances encryption performance by 150 percent.
The smartphone company has yet to confirm details on Kirin 970. With the fierce competition in the smartphone sector, the company has to release a new 10nm chipset to keep up with the competition.